Multifunctional and reconfigurable dual energy storage and transient thermal management solution for electronics

Project #4.38 begins in 2026.

Thermal management issues are particularly relevant to Army vehicle programs and the ever-increasing focus on incorporating electronic systems in military assets. While traditional thermal management approaches focus on steady-state operation, electronic components operate in transient mode, which is characterized by sharp temperature swings that can permanently damage devices besides causing reliability concerns. Phase change materials (PCM) are uniquely positioned to buffer cyclic thermal loading in power electronics.

We are developing a multifunctional, reconfigurable, dual energy storage, and transient thermal management solution for power electronics by incorporating PCM into copper foam structures. The modular reconfigurable energy storage unit is designed to serve as a high thermal conductivity heat spreader while waste heat is stored temporarily via solid-liquid phase change. The unit provides on-demand cooling by actively matching the heat generation rate in power electronics. Compared to conventional cooling solutions (e.g., cold plates and thermal ground planes), the novel cooling device is modular and easy-to-deploy with small form factor.

4.38